Samsung Electronics has concretized its 2-nanometer (nm; 1 nm = one billionth of a meter) foundry process roadmap. It announced plans to expand mass production to mobile in 2025, high-performance ...
2d
From Molten Metal to Precision Component: The Integrated Casting and CNC Solutions of Taiyuan Simis
2. Core Strengths: Why Taiyuan Simis Leads the Global Market Established in 2004, but rooted in a collective history spanning over 40 years, Taiyuan Simis has built a production ecosystem that few can ...
Zarlink Semiconductor today introduced a commercial foundry service for producing analog chips. Using Zarlink’s high-voltage, high-speed process, the foundry service is aimed at building chips for ...
A fresh rumor suggests MediaTek may turn to Intel’s 14A node for future Dimensity chips, boosting Intel Foundry buzz.
Lip-Bu Tan, the chief executive of Intel, is considering stopping the promotion of the company's 18A fabrication technology (1.8nm-class) to foundry customers, instead shifting the company's efforts ...
Seoul, Korea, June 11, 2010 - Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, today announced that its foundry business, Samsung Foundry, has qualified 32nm ...
DEEPX Signs 2nm Process Agreement with Samsung Foundry for Next-Generation AI Chip DX-M2 DEEPX has signed a 2nm process development agreement with Samsung Foundry to develop the world’s first ...
Samsung announced a comprehensive foundry process technology roadmap to 8nm, 7nm, 6nm, 5nm, 4nm and 18nm FD-SOI in its newest process technology roadmap. “The ubiquitous nature of smart, connected ...
Jazz Semiconductor, an independent wafer foundry focused primarily on specialty CMOS process technologies, today announced the availability of 0.5 micron BCD process technology targeted for power ...
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