The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

Samsung said it has begun mass production and commercial shipments of a new generation of high-bandwidth memory, called HBM4.

Micron has been one of the biggest winners in the AI boom.

Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

The high-bandwidth HBM4 chips are seen as a key component needed to scale-up the vast data centres powering the explosion in ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Samsung Electronics expects strong demand for memory chips to remain robust throughout this year and extend into next year, ...

SK Hynix's third-quarter revenue rose about 39%, year on year. Operating profit surged 62%. The company has benefited from a boom in artificial intelligence. It is a key supplier of high-bandwidth ...

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...

Samsung saw booming sales of HBM3E chips last year and this year it is starting to offer next-gen HBM4 chips. Also, it unveiled new stacking techniques and HBM-PIM.